ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 26    No. 6    June 2016

Microstructure and properties of Al/Cu bimetal in liquid-solid compound casting process
Yuan HU, Yi-qing CHEN, Li LI, Huan-dong HU, Zi-ang ZHU
(School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China)
Abstract: A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid-liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters (bonding temperature and preheating time) were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni-P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 °C for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×105 S/cm, respectively.
Key words: Al/Cu bimetal; solid-liquid compound casting; electroless Ni plating; Al2Cu phase; microstructure; mechanical properties; conductivity
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
Managed by Central South University (CSU)