ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 24    No. 6    June 2014

Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal
Jia-lei ZHAO, Jin-chuan JIE, Fei CHEN, Hang CHEN, Ting-ju LI, Zhi-qiang CAO
(School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China)
Abstract: A nickel-based coating was deposited on the pure Al substrate by immersion plating, and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 °C. The interface microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests. The results show that the Ni interlayer can effectively eliminate the formation of Al-Cu intermetallic compounds. The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases, while it is Ni-Cu solid solution at the Ni/Cu interface. The tensile shear strength of the joints is improved by the addition of Ni interlayer. The joint with Ni interlayer annealed at 500 °C exhibits a maximum value of tensile shear strength of 34.7 MPa.
Key words: Al/Cu bimetal; immersion Ni plating; interface; diffusion bonding; intermetallics
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
Managed by Central South University (CSU)